Versatile Magnetron Sputtering System For Functional Film Deposition Coating

Model: Lith-PC-JS01- Versatile Magnetron Sputtering System For Functional Film Deposition Coating

Application:
Designed for the preparation of nanoscale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor films, and dielectric films. It is widely suitable for scientific research and small-batch production in universities and research institutes. Equipped with an anode-layer ion source for pre-cleaning and assisted deposition, as well as a reverse sputtering function to enhance film quality and adhesion.

System Configuration:
The system consists of a sputtering vacuum chamber, permanent magnet sputtering targets (3 targets), a single-substrate heating stage, DC/RF power supplies, gas supply system, pumping system, vacuum measurement, electrical control system, and mounting platform.

Technical Specifications

Parameter	Specification
Chamber Structure	Vertical, top-loading; stainless steel & vacuum-compatible materials
Base Pressure (Sputtering Chamber)	≤5×10⁻⁶ Pa
Leak Rate	≤5×10⁻⁷ Pa·L/s
Pressure Rise Rate	≤1 Pa (after 12 hours of pump shutdown)
Pumping System	Domestic molecular pump + mechanical pump
Magnetron Targets	3 × 3-inch HV-compatible (2 standard field, 1 strong field)
Power Supplies	RF: 600 W, 13.56 MHz (auto-matching); DC: 2 × 1000 W
Target-Substrate Distance	40–120 mm (adjustable)
Substrate Heating	Max 450°C, programmable control
Film Thickness	Cu/Al: 4–5 μm; Ni/PTFE: 1–2 μm
Uniformity (2-inch area)	≤5% deviation
Adhesion Test	Withstands 3 tape-peeling tests (glass/si/ceramic)
Pre-Cleaning	Reverse sputtering capability
Ion Source	Anode-layer for cleaning & assisted deposition
Gas Control	2 MKS mass flow controllers (reactive/Ar); gas mixing
Baking Temperature	150°C (infrared heating)
Safety Features	Water/power failure interlock; anti-misoperation

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Key Features & Suitability

1. Precision Deposition

·Supports DC/RF sputtering for diverse materials (metals, semiconductors, dielectrics).

·Ion-assisted deposition enhances film density and adhesion.

2. High Vacuum Stability

·Ultra-low base pressure (≤5×10⁻⁶ Pa) ensures contamination-free films.

·Low leak rate maintains consistent process conditions.

3. User-Centric Design

·Vertical loading simplifies sample handling.

·Programmable substrate heating (up to 450°C) for optimized film growth.

4. Quality Assurance

·≤5% thickness uniformity and rigorous adhesion standards (tape test).

·Reverse sputtering and ion source for pre-deposition cleaning.

5. Research & Small-Batch Production

·Ideal for universities, labs, and industrial R&D in optics, electronics, and coatings.