Tel : +86-592-3926659
Email : gilia@inthelaboratory.com
Thermal Evaporation Evaporator Coating Coater System For Au, Ag, Al, Metal And Perovskite Films
Lith-QH-ZD01-High-Vacuum Multi-Material Evaporation
Product Overview
The Lith-QH-ZD01is a high-performance vacuum deposition system designed for precision thin-film coating applications in research and industrial laboratories. It features advanced vacuum technology, multi-source evaporation capabilities, and user-friendly controls, making it ideal for organic electronics, optoelectronics, and nanomaterials research.
Technical Specifications
|
No. |
Parameter |
Description |
|
Vacuum Chamber |
|
|
|
1 |
Ultimate Vacuum |
Better than 4×10–5 Pa (new equipment) |
|
2 |
Leak Rate |
6.7×10–8 Pa·L/s |
|
3 |
Working Vacuum |
5×10–4 Pa (Time from atmosphere to working vacuum <30 min) (For N2-purged glovebox-integrated systems, cold state) |
|
4 |
Vacuum Retention |
Pressure remains below 3 Pa after 24 hours post shutdown |
|
5 |
Sample Size |
300 × 300 mm |
|
6 |
Sample Holder Size |
360 × 360 mm |
|
7 |
Evaporation Sources |
4 organic + 4 metal sources |
|
8 |
Compatible Materials |
C60, BCP, Cu, Ag, LiF, MoO3, Al, etc. |
|
9 |
Evaporation Sources Configuration |
|
|
|
- Metal Sources: 4 water-cooled electrodes (compatible with 5cc ceramic Ta crucibles for Cu/Al). |
|
|
|
- Organic Sources: 4 standard Knudsen cells (10cc, max. 500°C). |
|
|
|
Performance Metrics: |
|
|
|
- Organic (NPB standard): Deposition rate 0.5–3 Å/s (±0.1 Å/s stability), uniformity ±5% (≤300×300 mm). |
|
|
|
- Metal (Al standard): Deposition rate 0.5–3 Å/s (±0.1 Å/s stability), uniformity ±5% (≤300×300 mm). |
|
|
10 |
Source-to-Substrate Distance |
530 mm (metal sources include extendable electrode rods, default 100 mm). |
|
11 |
Mask Library |
Not included (customizable upon request). |
|
12 |
Thickness Probes |
4 imported probes (1 probe monitors 2 sources). |
|
13 |
Thickness Display |
Real-time touchscreen monitoring: - Individual source rate/thickness/temperature (Knudsen cells). - Total thickness/rate (large-font display). |
|
14 |
Deposition Control |
Organic sources: Rate/temperature control. Metal sources: Rate control (manual/automated). |
|
15 |
Software |
Process lock function for repeatability. |
|
16 |
Closed Pumping |
Mechanical pump isolation feature to enhance productivity. |
Key Advantages
1. High Precision & Uniformity
1. Stable deposition rates (≤±0.1 Å/s variation) and excellent uniformity (±5%) ensure reproducible thin films for sensitive applications like OLEDs and solar cells.
2. Multi-Source Flexibility
1. Simultaneous evaporation of organic/metallic materials (8 total sources) enables complex multilayer structures without breaking vacuum.
3. Robust Vacuum Performance
1. Ultra-high vacuum (4×10–5 Pa) and low leak rate (6.7×10–8 Pa·L/s) guarantee contamination-free coatings.
4. User-Centric Design
1. Intuitive touchscreen interface, real-time monitoring, and glovebox compatibility streamline workflow for lab environments.
Recommended Applications
· Research: Organic semiconductors, perovskite solar cells, quantum dots.
· Industry: Optical coatings, flexible electronics, barrier films.
· Education: Thin-film deposition training, material science experiments.
IPv6 network supported 