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Email : gilia@inthelaboratory.com
Small Lab Vacuum Sputtering & Thermal Evaporation Evaporator Coater For Metal Film Preparation
Lith-BY-ZD03-Dual-function SEM Sample Preparation Instrument
1. Technical Specifications
Vacuum System
|
Parameter |
Specification |
|
Rotary Pumping Speed |
50 Hz: 8 m³/h (2.2 L/s) / 60 Hz: 9.6 m³/h (2.6 L/s) |
|
Vacuum Limit |
2 Pa |
|
Max Sputtering Current |
100 mA |
|
Max Evaporation Current |
100 A |
|
Sputtering Working Pressure |
20 Pa – 8 Pa |
|
Evaporation Working Pressure |
6 Pa – 4 Pa |
|
Working Vacuuming Time |
< 5 min (to 2 Pa) |
|
Vacuum Measurement |
Atmosphere to 2×10 mbar |
|
Gas Control |
Gas Flow Controller |
|
Chamber Size |
Ø150 × 120 mm (height), scratch-resistant quartz glass |
|
Magnetron Target Source |
Ø50 × 0.1 mm (Au) / Optional: Au, Ag, Pt |
|
Evaporation Target Source |
Carbon Rope |
|
Operation Method |
Manual (instruction manual included) |
|
Dimensions (Main Unit) |
360 mm (L) × 300 mm (W) × 380 mm (H) |
|
Dimensions (Evaporation Unit) |
360 mm (L) × 300 mm (W) × 160 mm (H) |
|
Weight |
55 kg |
|
Power Supply |
AC 110V 60Hz or AC 220V 50Hz |
|
Power Consumption |
< 2000 W |
|
Cooling Method |
Air Cooling (Evaporation) + Water Cooling (Sputtering) |
|
Warranty |
1-year limited warranty with lifetime product support |
Sputtering Parameters
· Sputtering Targets: Au (standard), optional Ag, Pt, Cr, Al, Cu
· Target Size: Ø50 mm
· Sample Stage: Adjustable height, accommodates Ø50 mm and Ø70 mm samples (customizable)
· Sputtering Voltage: 0–1600 V (DC, adjustable)
· Sputtering Current: 0–50 mA
· Sputtering Time: 0–360 s
Evaporation Parameters
· Evaporation Material: Carbon fiber rope
· Evaporation Current: 0–100 A (AC)
· Evaporation Voltage: 0–30 V
· Evaporation Time: 0–1 s
· Micro Vacuum Valve: Compatible with Ø3 mm tubing
General
· Input Voltage: 220 V (110 V optional), 50 Hz
· Vacuum Pump: 2 L/s rotary vane pump (domestic VRD-8)
2. Key Features
Dual-Function Advantages
· Integrated Design: Combines metal sputtering and carbon evaporation in one compact system
· Process Flexibility: Switch between conductive metal coatings (Au/Ag/Pt) and ultra-thin carbon films
· Time Efficiency: 5-minute pump-down enables rapid sample processing
User-Centric Design
· Transparent chamber for real-time monitoring
· Ergonomic controls with preset programs
· Tool-free target replacement system
IPv6 network supported 