RF&DC&MF Dual-Target PVD Sputtering Coating Euipment For Conductive Multilayer Films

Model: Lith-PC-JS06-RF&DC&MF for Conductive Multilayer Films

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Technical Parameters

No.	Parameter	Specification
1	Sputtering Chamber Ultimate Vacuum	≤6.6×10⁻⁶ Pa
2	System Leak Rate	≤5.0×10⁻⁷ Pa·L/S
3	Pump-Down Time (from atmosphere)	≤30 min to 6.6×10⁻⁴ Pa
4	Vacuum Retention (12h after shutdown)	≤5 Pa
5	Sputtering Chamber Dimensions	≥Ø300 mm × 300 mm
6	Magnetron Sputtering Targets	2 × 50 mm (RF/DC/MF compatible, adjustable)
7	Power Supplies	1 × 500W DC, 1 × 500W RF (auto-matching)
8	Film Uniformity	≤5%
9	Substrate Holder Rotation	0–30 RPM (adjustable)
10	Substrate Heating Range	RT–600°C (PID-controlled)
11	Gas Control	100 SCCM MFC, CF16/DN16 valves
12	Turbo Molecular Pump Speed	300 L/s
13	Mechanical Pump Speed	4 L/s
14	Vacuum Measurement	INFICON gauge
15	Control System	PLC + Industrial PC + Touchscreen (full automation)

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Key Features & Applications

1. Dual-Target Flexibility

·Supports multi-layer or composite film deposition (e.g., conductive/insulating stacks).

·RF/DC/MF compatibility enables processing of magnetic materials.

2. High Vacuum Performance

·Ultra-low base pressure (≤6.6×10⁻⁶ Pa) minimizes contamination for high-purity films.

·Fast pump-down and excellent vacuum retention reduce downtime.

3. Precision Process Control

·PID-controlled heating (RT–600°C) for annealing or stress management.

·Automated gas flow (MFC) and power adjustment for reproducible results.

4. User-Centric Design

·Rotating substrate holder ensures uniform coating (≤5% non-uniformity).

·Touchscreen + PLC automation simplifies operation and reduces human error.

5. Compact & Mobile

·Lockable wheeled frame suits lab environments with space constraints.

Ideal For:

· Research: Thin-film studies (semiconductors, optics, tribology).

· Industry: Functional coatings (wear-resistant, decorative, or barrier films).

· Magnetic Materials: Sputtering of Fe, Co, Ni alloys or oxides.