High Vacuum Magnetron Sputtering Deposition PVD System For Multilayer & Multitarget
Model: Lith-PC-JS07-High Vacuum & Multilayer & Multitarget
Key Features & Applications
The Lith-PC-JS07 is designed for nano-scale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor layers, and dielectric films. Ideal for research institutions and universities, it supports both material science studies and small-batch production.
System Components
· Vacuum chamber system (sputtering chamber)
· Target & power supply system
· Sample stage system
· Vacuum pumping & measurement system
· Gas flow system
· Control system
· Film thickness monitoring system
· Top cover lifting mechanism
· Electrical control system
· Computer-controlled system & auxiliary components
Technical Specifications
Parameter
Value
Ultimate Vacuum
6.7×10-5 Pa
System Leak Rate
1×10-7 Pa·L/S
Vacuum Recovery Time
≤40 min to 6.6×10 Pa (after N2 purge)
Chamber Design
Round chamber, Ø450×350 mm
Sample Stage
3-inch × 3-inch (3.2 mm thick)
Heating Temperature
600°C ±1°C (programmable)
Sample Rotation
Self-rotation: 0–50 RPM (uniformity)
Revolution: Position-switching capability
Magnetron Target
3 targets (standard)
Effective Sputtering Area: 3-inch × 3-inch
Type: Permanent magnet, brazed indirect water-cooled
Deposition Mode
Upward sputtering (planar target)
Substrate Bias Voltage
Up to –200 V
Gas Flow System
2-channel mass flow controller
Thickness Monitor
Quartz crystal sensor (0–999,999 Å)
Pumping Options
Turbo molecular pump / Cryogenic pump + Dry scroll pump
Control & Automation
· Real-time monitoring: Tracks displacement and revolution speed.
· Error analysis: Displays deviations via curves/numerical data.
· Flexible display: Switch between linear and logarithmic scales for revolution speed vs. displacement.
· Advanced modes: Supports fixed-point deposition and resistive evaporation coating.
Why Choose?
✔ High Precision: Programmable heating (±1°C) and dual-axis sample motion ensure uniform film growth.
✔ Versatile Configurations: Compatible with multiple target materials and pumping systems.
✔ Research-Oriented: Combines in-situ thickness control with automated process logging for reproducible results.
Ideal for: Advanced material research, optical coatings, semiconductor layers, and protective coatings development.

|
Parameter |
Value |
|
Ultimate Vacuum |
6.7×10-5 Pa |
|
System Leak Rate |
1×10-7 Pa·L/S |
|
Vacuum Recovery Time |
≤40 min to 6.6×10 Pa (after N2 purge) |
|
Chamber Design |
Round chamber, Ø450×350 mm |
|
Sample Stage |
3-inch × 3-inch (3.2 mm thick) |
|
Heating Temperature |
600°C ±1°C (programmable) |
|
Sample Rotation |
Self-rotation: 0–50 RPM (uniformity) Revolution: Position-switching capability |
|
Magnetron Target |
3 targets (standard) Effective Sputtering Area: 3-inch × 3-inch Type: Permanent magnet, brazed indirect water-cooled |
|
Deposition Mode |
Upward sputtering (planar target) |
|
Substrate Bias Voltage |
Up to –200 V |
|
Gas Flow System |
2-channel mass flow controller |
|
Thickness Monitor |
Quartz crystal sensor (0–999,999 Å) |
|
Pumping Options |
Turbo molecular pump / Cryogenic pump + Dry scroll pump |
✔ Versatile Configurations: Compatible with multiple target materials and pumping systems.
✔ Research-Oriented: Combines in-situ thickness control with automated process logging for reproducible results.








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Email : gilia@inthelaboratory.com









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