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Glovebox PVD Magnetron Sputtering System For Functional Composite Film Deposition Fabrication
Model: Lith-PD-JS02-PVD Magnetron Sputtering System
Product Overview
The Lith-PD-JS02 High-Vacuum Magnetron Sputtering System is a specialized R&D equipment designed for cutting-edge applications in perovskite solar cells, OLEDs, lithium batteries, quantum dot LEDs, OPVs, and other advanced industries. It enables the deposition of nanoscale oxide, nitride, and metallic thin films. The system integrates seamlessly with glovebox environments, ensuring anhydrous/oxygen-free conditions for the entire process—from spin-coating and sputtering to testing—via a hardware-coupled PVD and glovebox system.
Key Features
1. Low-Pressure Sputtering Technology (Optional)
1. Delivers dense thin films with minimal substrate damage.
2. High-Precision Chamber Design
1. SUS304 stainless steel sputtering chamber with mirror-polished interior (including shielding plates) for ultra-clean conditions and optimal vacuum performance.
3. Flexible Control Options
1. Manual/Auto Control: Siemens PLC + touchscreen interface.
2. Fully Automated: PC + PLC integration.
Technical Specifications
Parameter
Details
Overall Dimensions (L×W×H)
1100 × 800 × 1900 mm
Chamber Dimensions (L×W×H)
440 × 440 × 450 mm
Substrate Stage
Max. temperature: 500°C (±1°C accuracy)
Ultimate Vacuum
2 × 10−5 Pa
Pumping Speed & Hold
≤8 × 10−4 Pa in 20 min; ≤5 Pa over 12 hours
Deposition Uniformity
±3% to ±5% across the tray
Target Options
Rectangular: 210×210 mm / 300×300 mm; Circular targets available
Applications & Advantages
Ideal For:
· Research & Prototyping: Tailored for sensitive materials requiring inert environments (e.g., perovskites, OLED layers).
· Multi-Process Integration: Combines sputtering, spin-coating, and testing in a single glovebox workflow, minimizing contamination risks.
· High-Quality Films: Superior uniformity and low-defect deposition critical for optoelectronic and energy storage devices.
Why Choose This System?
· Glovebox Compatibility: Unique airtight integration for oxygen/moisture-sensitive processes.
· Versatile Configurations: Supports diverse target geometries and automation levels.
· Industry-Grade Precision: Tight temperature control (±1°C) and high vacuum stability ensure reproducible results.
Product Overview
The Lith-PD-JS02 High-Vacuum Magnetron Sputtering System is a specialized R&D equipment designed for cutting-edge applications in perovskite solar cells, OLEDs, lithium batteries, quantum dot LEDs, OPVs, and other advanced industries. It enables the deposition of nanoscale oxide, nitride, and metallic thin films. The system integrates seamlessly with glovebox environments, ensuring anhydrous/oxygen-free conditions for the entire process—from spin-coating and sputtering to testing—via a hardware-coupled PVD and glovebox system.
Key Features
1. Low-Pressure Sputtering Technology (Optional)
1. Delivers dense thin films with minimal substrate damage.
2. High-Precision Chamber Design
1. SUS304 stainless steel sputtering chamber with mirror-polished interior (including shielding plates) for ultra-clean conditions and optimal vacuum performance.
3. Flexible Control Options
1. Manual/Auto Control: Siemens PLC + touchscreen interface.
2. Fully Automated: PC + PLC integration.
Technical Specifications
Parameter
Details
Overall Dimensions (L×W×H)
1100 × 800 × 1900 mm
Chamber Dimensions (L×W×H)
440 × 440 × 450 mm
Substrate Stage
Max. temperature: 500°C (±1°C accuracy)
Ultimate Vacuum
2 × 10−5 Pa
Pumping Speed & Hold
≤8 × 10−4 Pa in 20 min; ≤5 Pa over 12 hours
Deposition Uniformity
±3% to ±5% across the tray
Target Options
Rectangular: 210×210 mm / 300×300 mm; Circular targets available
Applications & Advantages
Ideal For:
· Research & Prototyping: Tailored for sensitive materials requiring inert environments (e.g., perovskites, OLED layers).
· Multi-Process Integration: Combines sputtering, spin-coating, and testing in a single glovebox workflow, minimizing contamination risks.
· High-Quality Films: Superior uniformity and low-defect deposition critical for optoelectronic and energy storage devices.
Why Choose This System?
· Glovebox Compatibility: Unique airtight integration for oxygen/moisture-sensitive processes.
· Versatile Configurations: Supports diverse target geometries and automation levels.
· Industry-Grade Precision: Tight temperature control (±1°C) and high vacuum stability ensure reproducible results.
|
Parameter |
Details |
|
Overall Dimensions (L×W×H) |
1100 × 800 × 1900 mm |
|
Chamber Dimensions (L×W×H) |
440 × 440 × 450 mm |
|
Substrate Stage |
Max. temperature: 500°C (±1°C accuracy) |
|
Ultimate Vacuum |
2 × 10−5 Pa |
|
Pumping Speed & Hold |
≤8 × 10−4 Pa in 20 min; ≤5 Pa over 12 hours |
|
Deposition Uniformity |
±3% to ±5% across the tray |
|
Target Options |
Rectangular: 210×210 mm / 300×300 mm; Circular targets available |
IPv6 network supported 