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Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition
Model: Lith-PD-JS03-Multi-target For Multilayer Films Deposition
Product Overview
The Lith-PD-JS03 magnetron sputtering system is designed for scientific research institutions and university laboratories. Featuring core components system offers stable performance, high automation, and serves as a competitive alternative to imported equipment.
Key Features
1. Versatile Sputtering Modes
·Compatible with both DC and RF sputtering sources, enabling deposition of metallic, non-metallic, and compound thin films.
·Supports multi-layer and composite film deposition for advanced material research.
2. Superior Film Quality
·Delivers excellent uniformity (±3%~5%) and repeatability for metals, semiconductors, and insulating materials.
3. Optimized Configuration
·Equipped with three 3-inch circular target guns, mounted in a co-focal upward sputtering arrangement.
·Adjustable sputtering area: 2–4 inches (compatible with 2–3 inch targets).
Technical Specifications
Parameter
Value / Description
System Dimensions (L×W×H)
850 × 1100 × 1900 mm
Chamber Dimensions (L×W×H)
400 × 400 × 380 mm
Substrate Stage
Max temperature: 600°C (±5°C accuracy)
Ultimate Vacuum
≤ 5 × 10−5 Pa
Pump-down & Holding
≤ 8 × 10−4 Pa in 30 min; ≤ 8 Pa over 12 hours
Uniformity
Better than ±3%–5%
Target Configuration
3 guns (2–3 inch), 2–4 inch deposition area
Application Scope
The Lith-PD-JS03 is ideal for depositing nitrides, oxides, and other functional films, catering to:
· Semiconductor research (e.g., conductive/dielectric layers).
· Optical coatings (anti-reflective, protective films).
· Advanced materials (multilayer structures, composite films).
Installation Notes
1. Leveling: Ensure absolute horizontal alignment using a spirit level to guarantee film uniformity.
2. Connections: Securely attach power, cooling water, and vacuum pipelines, checking all seals for leaks.
3. Inspection: Verify no physical damage occurred during transit.
Working Principle
The system utilizes glow discharge of inert gases to generate ionized particles. These particles bombard the target surface, ejecting atoms/molecules that condense on the substrate to form thin films. Secondary electrons sustain plasma, enhancing deposition efficiency.
Why Choose?
· Reliability: Premium components ensure long-term stability.
· Flexibility: Dual-mode sputtering for diverse materials.
· Precision: Tight temperature/vacuum control for reproducible results.
Product Overview
The Lith-PD-JS03 magnetron sputtering system is designed for scientific research institutions and university laboratories. Featuring core components system offers stable performance, high automation, and serves as a competitive alternative to imported equipment.
Key Features
1. Versatile Sputtering Modes
·Compatible with both DC and RF sputtering sources, enabling deposition of metallic, non-metallic, and compound thin films.
·Supports multi-layer and composite film deposition for advanced material research.
2. Superior Film Quality
·Delivers excellent uniformity (±3%~5%) and repeatability for metals, semiconductors, and insulating materials.
3. Optimized Configuration
·Equipped with three 3-inch circular target guns, mounted in a co-focal upward sputtering arrangement.
·Adjustable sputtering area: 2–4 inches (compatible with 2–3 inch targets).
Technical Specifications
Parameter
Value / Description
System Dimensions (L×W×H)
850 × 1100 × 1900 mm
Chamber Dimensions (L×W×H)
400 × 400 × 380 mm
Substrate Stage
Max temperature: 600°C (±5°C accuracy)
Ultimate Vacuum
≤ 5 × 10−5 Pa
Pump-down & Holding
≤ 8 × 10−4 Pa in 30 min; ≤ 8 Pa over 12 hours
Uniformity
Better than ±3%–5%
Target Configuration
3 guns (2–3 inch), 2–4 inch deposition area
Application Scope
The Lith-PD-JS03 is ideal for depositing nitrides, oxides, and other functional films, catering to:
· Semiconductor research (e.g., conductive/dielectric layers).
· Optical coatings (anti-reflective, protective films).
· Advanced materials (multilayer structures, composite films).
Installation Notes
1. Leveling: Ensure absolute horizontal alignment using a spirit level to guarantee film uniformity.
2. Connections: Securely attach power, cooling water, and vacuum pipelines, checking all seals for leaks.
3. Inspection: Verify no physical damage occurred during transit.
Working Principle
The system utilizes glow discharge of inert gases to generate ionized particles. These particles bombard the target surface, ejecting atoms/molecules that condense on the substrate to form thin films. Secondary electrons sustain plasma, enhancing deposition efficiency.
Why Choose?
· Reliability: Premium components ensure long-term stability.
· Flexibility: Dual-mode sputtering for diverse materials.
· Precision: Tight temperature/vacuum control for reproducible results.
|
Parameter |
Value / Description |
|
System Dimensions (L×W×H) |
850 × 1100 × 1900 mm |
|
Chamber Dimensions (L×W×H) |
400 × 400 × 380 mm |
|
Substrate Stage |
Max temperature: 600°C (±5°C accuracy) |
|
Ultimate Vacuum |
≤ 5 × 10−5 Pa |
|
Pump-down & Holding |
≤ 8 × 10−4 Pa in 30 min; ≤ 8 Pa over 12 hours |
|
Uniformity |
Better than ±3%–5% |
|
Target Configuration |
3 guns (2–3 inch), 2–4 inch deposition area |
IPv6 network supported 