Nano Dual-Target Magnetron Sputtering Coating System For Multilayer Films Deposition

Model: Lith-PC-JS08-Dual-Target, Multilayer Films Deposition

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Equipment Purpose

Designed for nano-scale single/multilayer functional films (hard coatings, metals, semiconductors, dielectrics). Features pre-sputtering cleaning for enhanced adhesion.

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System Components

· Vacuum chamber, dual magnetron targets, heating stage, DC/RF power supplies, gas delivery, vacuum pumps, control system.

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Technical Parameters

Category	Specification
Chamber Structure	Vertical front-loading; stainless steel/vacuum materials
Base Pressure	≤5×10−5 Pa
Leak Rate	≤5×10−7 Pa·L/s
Pressure Rise Rate	≤10 Pa (after 12 hours, pump off)
Pumping System	Domestic molecular pump + mechanical pump
Targets	2× 4-inch HV (1 standard-field, 1 strong-field); DC/RF compatible (Kurt J. Lesker)
Target-Sample Distance	40–120 mm (multilayer); 80–120 mm (with ion source)
Power Supplies	RF: 1000 W, 13.56 MHz (auto-matching); DC: 1000 W (AE brand)
Sample Stage	3 substrates; 5–30 RPM rotation; 450°C heating; 1000 V bias
Film Thickness	Cu/Al: 4–5 μm; Ni/PTFE: 1–2 μm (±5% uniformity over 2-inch area)
Adhesion Test	Passes 3-tape peel (glass/Si/ceramic)
Gas System	2 MKS mass flow controllers (Ar + reactive gas); mixing capability
Baking Temperature	150°C (infrared heating)

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Key Features

1. Dual-Target Flexibility

o Enables co-sputtering or sequential deposition for complex multilayers.

2. High Adhesion & Cleanliness

o Integrated pre-sputtering cleaning and ion-assisted deposition (anode-layer source).

3. Precision Process Control

o Programmable temperature (450°C max), rotation (5–30 RPM), and gas flow.

4. Safety & Reliability

o Interlocks for power/water failures; manual controls for critical operations.

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Target Applications

· Research: Nanomaterials, thin-film physics, prototype development.

· Education: Advanced deposition techniques training.

· Industry: Small-batch functional coatings (e.g., optics, electronics).