DC/RF Nano High-Precision Sputtering Coater Film Deposition System With Rotatable Triple-targets 

Model: Lith-PC-JS03-Rotatable Triple-targets 

Technical Specifications

Category	Parameter	Value/Description
Chamber Structure	Design	Vertical front-loading, stainless steel
	Sample Access	Easy loading/unloading
Vacuum Performance	Base Pressure	≤5×10−5 Pa
	Leak Rate	≤5×10−7 Pa·L/s
	Pressure Rise Rate (12h)	≤10 Pa
	Pumping System	Domestic molecular pump + mechanical pump
Targets & Power Supplies	Target Quantity & Size	3 × 2-inch magnetron targets (HV compatible)
	Target Types	1 × Standard magnetic field, 1 × Strong magnetic field
	Target-Substrate Distance (Multilayer)	40–120 mm
	Target-Substrate Distance (Ion Source)	80–120 mm
	RF Power Supply	1 × 1000 W, 13.56 MHz (auto-matching)
	DC Power Supply	2 × 1000 W
Substrate Holder	Capacity	Up to 3 substrates
	Rotation Speed	5–30 RPM (self-rotation + planetary)
	Heating Range	Programmable up to 450°C
	Bias Voltage	Supports up to 1000 V
Gas Control System	Gas Lines	2 independent MKS mass flow controllers (Ar + reactive gas)
	Features	Gas mixing, adjustable/measurable chamber pressure
Additional Features	Chamber Baking	Infrared heating (150°C)
	Liner Plate	Prevents chamber contamination
	Safety Protections	Water/power failure interlock, anti-misoperation protection

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Key Features & Applications

1. Advanced Deposition Capabilities

· Supports DC/RF sputtering for metals, semiconductors, and insulators.

· Triple-target design enables sequential multilayer deposition without vacuum breaks.

2. Precision Process Control

· Programmable substrate heating (±450°C) with adjustable ramp rates.

· Rotation mechanism (5–30 RPM) ensures uniform film thickness.

3. Research & Small-Batch Flexibility

· Ideal for nanoscale functional films (e.g., optoelectronics, tribological coatings).

· Reverse sputtering cleaning enhances film adhesion and purity.

4. User-Centric Design

· Manual controls for target shutters, rotation, and temperature.

· Safety systems mitigate operational risks (e.g., interlock protections).

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Target Users

· Academic & Government Labs: Thin-film material R&D.

· Industrial Prototyping: Small-scale production of specialized coatings.