VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is capable for co-sputtering or deposition of multiple layer films for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015. Film Thickness Monitor is not included.)
SPECIFICATIONS
Power
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208-240 VAC, single phase, 50/60 Hz, 500 W
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Source Power
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DC source: 500 W power for coating metallic materials
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RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials
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Magnetron Sputtering Head
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Vacuum Chamber
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Stainless steel vacuum chamber: Ø300 × 300 mm H
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One 100 mm glass view port.
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Hinged type top flange for easy sample access
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Here is a glance of the vacuum chamber
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Sample Stage
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Ø140 mm rotating and heating sample stage up to 500°C
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Rotation speed: 1 - 20 rpm
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Single-point programmable temperature controller
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Gas Flow Control
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Vacuum Pump Station
(Optional)
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For air-sensitive targets, such as Al, Ti, Cr, etc, or base pressure <1e-2 torr, a pumping station is recommended
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Turbo pump .
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Backing pump
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Water Chiller
(Optional)
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Chilled water is required
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One digital temperature-controlled recirculating water chiller is recommended
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Refrigeration range: 5~35 °C
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Flow rate: 16 L/min
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Pump pressure: 14 psi
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Film Thickness Measurement
(Optional )
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Overall Dimensions
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Net Weight of Coater
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Shipping Weight & Dimensions
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Total 2 Pallets
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#1: 520 lbs, 52" x 40" x 50"
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#2: 420 lbs, 48" x 40" x 45"
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Compliance
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CE approval
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NRTL Certification (UL 1450) is available upon request at extra cost
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Application Notes
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Please use 5N purity Argon gas for plasma sputtering.
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For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
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MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order)
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MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
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HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
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DO NOT use DI water in a water chiller. Use distilled water
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The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together)
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